DRAM SIMM 30 Pin

30-pin SIMM pinout: JEDEC-standard 8-bit (9-bit with parity) FPM DRAM module running at 5 V, used in PCs and Macs from circa 1986 to 1993.

30 PIN SIMM DRAM 30 PIN SIMM DRAM

  • SIMM = Single Inline Memory Module
  • DRAM = Dynamic Random Access Memory

The 30-pin SIMM is a JEDEC-standardised memory module providing an 8-bit data bus (9-bit with optional parity) and operating from a single +5 V supply. It uses Fast Page Mode (FPM) DRAM and supports capacities from 256 KB to 4 MB per module, with refresh accomplished via RAS-only, CAS-before-RAS (CBR), or hidden-refresh cycles. Introduced around 1986, it was the dominant desktop memory format through the early 1990s, used in IBM-compatible PCs, Apple Macintosh systems, and workstations before being superseded by the 72-pin SIMM around 1993.

PinNameDescription
1VCC+5 VDC
2/CASColumn Address Strobe
3DQ0Data 0
4A0Address 0
5A1Address 1
6DQ1Data 1
7A2Address 2
8A3Address 3
9GNDGround
10DQ2Data 2
11A4Address 4
12A5Address 5
13DQ3Data 3
14A6Address 6
15A7Address 7
16DQ4Data 4
17A8Address 8
18A9Address 9
19A10Address 10
20DQ5Data 5
21/WEWrite Enable
22GNDGround
23DQ6Data 6
24A11Address 11
25DQ7Data 7
26QPData Parity Out
27/RASRow Address Strobe
28/CASP/CAS line for the parity RAM on the card *
29DPData Parity In
30VCC+5 VDC

Signals

  • VCC — +5 V supply (pins 1 and 30); tolerance ±10 %.
  • /CAS — Column Address Strobe; latches the column portion of the multiplexed row/column address on the falling edge.
  • DQ0–DQ7 — Bidirectional 8-bit data bus; TTL-compatible inputs and outputs.
  • A0–A11 — Multiplexed row/column address inputs; not all lines are active on every module capacity (see Notes).
  • GND — Ground reference (pins 9 and 22).
  • /WE — Write Enable; selects a read or write cycle.
  • /RAS — Row Address Strobe; latches the row address and initiates an access cycle.
  • QP — Data Parity Output; driven by the parity DRAM on parity-equipped modules. Not connected (N/C) on non-parity modules.
  • DP — Data Parity Input; carries the expected parity bit from the host for write operations. N/C on non-parity modules.
  • /CASP — Separate Column Address Strobe for the parity DRAM chip (*); see Notes. N/C on non-parity modules.

Notes

  • (*) Parity motherboards required additional time to generate a parity bit, so the CAS signal for the parity DRAM had to be controlled separately from the main /CAS line — hence the dedicated /CASP pin.
  • QP, DP, and /CASP are N/C on SIMMs without parity. The module shown is a 4 MB × 9 (parity) configuration.
  • Address line usage varies with capacity: A9 is N/C on 256 KB modules; A10 is N/C on 256 KB and 1 MB modules; A11 is N/C on 256 KB, 1 MB, and 4 MB modules.
  • Speed options include 60 ns access / 110 ns cycle (−6) and 70 ns access / 130 ns cycle (−7).
  • All signals are TTL-compatible; standby power consumption is typically around 6 mW, rising to approximately 450 mW active.

References

Category:Memory Connectors